Uncooled Thermal Imaging Module
Ultra small volume, ultra-low power consumption and ultra light weight
a) Benefit from the size advantages of ASIC and wafer level packaging;
b) Benefit from the low power consumption characteristics of ASIC;
c) Mini series infrared module has only one circuit board, which is extremely lightweight.
d) Compared with traditional FPGA, the volume is only 1 / 6, the power consumption is only 1 / 3, and the price is more advantageous;
e) Independently developed wafer level package detector, smaller size and lighter weight.
f) Equipped with industry-leading infrared image processing algorithm and temperature measurement algorithm, it provides high-quality image and high-precision temperature measurement function.
The interface is rich, flexible and easy to integrate
a) The module form supports DVP parallel port digital video output, SPI video transmission, I2C and UART communication interfaces;
b) Support digital video formats such as raw14, YUV, Y8, BT.656 and lvcmos;
c) Support simultaneous output of image data + temperature data;
d) MCU is integrated internally to provide secondary development SDK.