Плата управления lvds, гибкая печатная плата DIP для поверхностного монтажа

Products Description

Seq

ltem

capability

1

Base Material

FR-4, High TG FR-4 , Halogen Free material ,CEM-3,CEM-1,PTFE,Rogers ,Arlon,Taconic,Aluminum base,PI ,etc

2

Layers

1-40 (≥30 layers needs review)

3

Finished inner/outer copper thickness

0.5-60Z

4

Finished board thickness

0.2-7. 0mm(s0.2mm needs review),≤0 4mm for HASL

Board thicknesss1 .0mm: +/-0. 1mm 1Board thickness>2 .0mm: +/-8%

5

Max panel size

≤2sidesPCB: 600*1500mm Multilayer PCB: 500*1200mm

6

Min conductor line width/spacing

Inner layers:≥3/3mil Outer layers: 23.5/3.5mil

7

Min hole size

Mechanical hole: 0. 15mm Laser hole: 0.1mm

Driling precision: first dilling First dilling: 1mil Second dilling: 4mil

8

Warpage

Board thicknesss0.79mm: β≤1.0% 0.80sBoard thicknesss2 4mm: βs0.7% Board thickness22 5mm: β≤0. 5%

9

Controlled Impedance

+/- 5 % 2(<502).+/-10%(2500),.>5002+/-5% (needs review)

10

Aspect Ratio

15:01

11

Min welding ring

4mil

12

Min solder mask bridge

≥0.08mm

13

Plugging vias capability

0.2-0. 8mm

14

Hole tolerance

PTH: +/-3mil NPTH: +/-2mil

15

Outine profile

Rout/ V-cut/ Bridge/ Stamp hole

16

Solder mask color

Green,yellow,black,blue,red,white,matte green

17

Component mark color

white，yellow,black

18

Surface treatment

0SP.0.2-0.5um HASL: 2-40um Lead free HASL: 2-40um ENIG: Au 1-10U" ENEPIG: PB 2-5U"/ Au 1-8U" Immersion Tin:0.8-1 .5um Immersion
silver: 0.1-1 .2um Peelable blue mask Carbon ink Gold plating: Au 1-1 50U"

19

E-Test

Flying probe tester: 0.4-6.0mm,max 19.6*23. 5inch

Min spacing from test pad to board edge : 0.5 mm

Min conductive resistance :5 Q

Max insulation resistance : 250 MQ

Max test voltage : 500 V

Min test pad diameter:6 mil

Min test pad to pad spacing: 10 mil

Max test current : 200 MA

20

A0I

Orbotech SK-75 AOI : 0.05-6.0mm,max 23.5*23.5inch

Orbotech Ves machine : 0.05-6.0mm,max 23.5*23.5inch

21

ODM / OEM Services

We have 6 SMT / SMD production line and 2 DIP production line