Free sample QJ301 copper brazing flux powder
Free sample QJ301 copper brazing flux powder
Free sample QJ301 copper brazing flux powder
Free sample QJ301 copper brazing flux powder
Free sample QJ301 copper brazing flux powder
Free sample QJ301 copper brazing flux powder

Free sample QJ301 copper brazing flux powder

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Product Overview

Description









Specification


Specifications
Alloy Composition
Sn42Bi58
Halogen (W/F)
Halogen Free
Metal Content %
90±0.5 Weight%
Powder Size
20~38um 
Flux Type
RMA No-Clean
Viscosity Range
190±30Pa/s
Expansion Rate
> 80%
Tin Bead Test
<3
Melting Point
138℃




Product Description


Advantage 1.

Less Residue, higher insulation resistance.


With No-clean Flux, after soldering, there no residue at the surface of the product. Also can keep a transparent appearance and high insulation resistance.



Advantage 2.

Suitable viscosity, no collapse and excursion.


By using our own formula and environmental friendly soldering Flux, our solder paste can keep very good Thixotropic Behavior and stable viscosity. Also our solder paste have excellent Thermal collapse protection, this will privide quality guarantee for production.



Advantage 3

Strong wettability, high Tin climbing performance.


The Wettability and Tin Climbing performace will decide the Soldering  quality. 

Also we have strong grinding machine, can provide different size Solder Powder. Diameter of the powder from 5μm~75μm available. Suitbale for different kinds production requirements.




Advantage 4.

Directly manufacturer and dust-free plant.


Our factory lcated in Shenzhen-China, we have our own factory to manufacturing Soldering Wire/Solder Bar. 

And also a separate Solder Paste plant which with Dust-free working room. To make sure the products are clean and purity.

Also we cooperate with the biggest mine field provider in China, to ensure our stable and fresh raw material supply.



Applications


138℃ Low Melting Point Solder Paste

Sn42Bi58 Solder Paste is just 138℃ low temperature, tin solder (solder material) can keep lucent surface with less dregs, which greatly reduces cost. It is special applicable to various low temperature soldering, especially good in inductance wires, transformer and other industries. The alloy composition can be changed according to specific requirement.



Product Name
Sn42Bi58 Lead free solder paste
Material Chemical Type
Welding paste
Composition
CAS #
Percentage Content (%)
OSHA PEL (mg/m³)
TLV-TWA (mg/m³)
TLV-STEL (mg/m³)
Sn
7440-31-5
41-43
2
2
N/A
Bi
/
57-59
/
/
N/A
Rosin/ Flux
65997-06-0
2.0~3.0
N/A
0.1
N/A


Instruction


Transport.

For Solder Paste transportation, better by air. And the transport time better less than 5 weeks. 



Begin Using.

Once get the solder paste, it should be kept at refrigerator and keep for 2~4 hours before begin normal production.

And solder paste removed from cold storage, do not open immediately, to prevent fogging, must be left at room temperature (2-4 hours) and the solder paste temperature back to 25 ℃ before open storage use.



Storage.

After use, the solder paste must be stored in a clean and pollution-free empty bottle, sealed and stored in a cold storage, and cannot be mixed with the new solder paste. The preservation period of the solder paste after opening is 6 days. If the storage period exceeds 6 days, please discard it to ensure its production quality.

Also there is the Expiry Time with different temperature: 

0-10℃: 6 months (Seal Storage)
>10℃: 15 days   (Seal Storage)
After open: 6 days  (Seal Storage)



Attention.

Be infected with hands and feet carelessly, rinse with soap and water immediately, do not knead with hand, a few remain can be swabbed with alcohol.



Production Recomend


Printing Conditions.



Scraper
Hardness 80-90 degrees
Sheet material
Stainless steel mesh mold or wire mesh
material
Rubber or stainless steel
The thickness of the sheet
Stainless steel formwork 0.12-0.25mm
Scraper speed
10-150 - mm/SEC
Environment
Temperature: 25 ± 5L; Humidity: 40-60% RH
Blade Angle
60-90
The wind
will break the adhesive properties of the paste


Reflow Oven.

Setting different temperatures based on different alloy and machines features. Also need to consider pcb layout, circuit width then to adjust the processing temperature.


Here are the recommended parameters for reflow oven.

(1)Ramp to Reflow: Ramp Speed set at 1℃~3℃/second, At preheating zone, if the temperature ramp to fast will break the solder paste's mobility and components. This will arise Tin Blasting and tin ball problems.

(2)Preheating Zoon: Temperature better at 140~170℃, time at 80~150 seconds. If temperature is too low, there will make solder not fully melting problem.

(3)Reflow: Peak Temp. Setting at 210℃~230℃. While Temp. ≥183℃, time set at 60~100 seconds. ≥200℃ set at 40~80 seconds.

(4)Cooling: Cooling Speed <4℃/second.



Certifications




Company Information




Package & Delivery






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